WS X299 SAGE

* The Intel® Turbo Boost Max Technology 3.0 support depends on the CPU types,Supports Intel® Virtual RAID on CPU (VROC),Intel® Socket 2066 Core™ X-Series 處理器,*有關支援的 CPU 型號資訊，請參閱 tw.asus.com 網站內容。

Intel® X299

8 x DIMM, 最高可支援到256GB, DDR4 4200(O.C.)/4133(O.C.)/4000(O.C.)/3600(O.C.)/2933/2666/2400/2133 MHz 非ECC, 無緩衝區 記憶體,* Only on Select SKUs, With 1 DIMM per channel. Additional DIMM loading on any channel may impact maximum memory speed by one bin.,* Actual memory frequency differs from Intel CPU types and memory module. Please check Intel official site for more detail about the memory types supported by each CPU.,Intel® Core™ X-series Processors (4-core),4 x DIMM, Max. 64GB, DDR4 4200(O.C.)/4133(O.C.)/4000(O.C.)/3600(O.C.)/2666/2400/2133 MHz 非ECC, 無緩衝區 Memory,Intel® Core™ X-series Processors (6-core above),支援 Intel® Extreme Memory Profile (XMP),*是否支援 Hyper DIMM 需視個別 CPU 的實體特性而定。

支援 AMD 4-Way CrossFireX 技術,支援 NVIDIA® 4-Way SLI™ 技術

7 x PCIe 3.0/2.0 x16 (single x16 or dual x16/x16 or triple x16/x16/x16 or quad x16/x16/x16/x16 or seven x16/x8/x8/x8/x8/x8/x8) *²

Support Intel^® Rapid Storage Technology enterprise 5.1 for X-Series(6-core and above) CPU RAID,Supports Intel® Smart Response Technology,Intel® Rapid Storage Technology 15 support,1 x M.2 Socket 3, with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode),2 x U.2 connector*¹,Intel® Virtual RAID (VROC) support for CPU RAID,Intel® X299 Chipset : ,1 x M.2 Socket 3, with M key, type 2242/2260/2280 storage devices support (PCIE 3.0 x 4 mode),Intel® Optane™ Memory Ready,支援Raid 0, 1, 5, 10,8 x SATA 6Gb/s埠

Intel® I219-LM , 1 x Gigabit 區域網路控制器,Intel® I210-AT, 1 x Gigabit 區域網路控制器

- Audio amplifier: Provides the highest-quality sound for headphone and speakers,- 支援 : 插頭偵測, 多路音頻輸出輸入, Front Panel MIC Jack-retasking,- High quality120dBSNR stereo playback output(Line-out at rear)and113dB(Line-in),- DTS Connect,Separate layer for left and right track, ensuring both sound deliver equal quality,Realtek® ALC S1220A7.1-Channel 高傳真音效 CODEC,- DTS Headphone:X,- Unique de-pop circuit: Reduces start-up popping noise to audio outputs,- Internal audio Amplifier to enhance the highest quality sound for headphone and speakers,- Premium Japanese-made audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity,- Impedance sense for front and rear headphone outputs,Audio Feature :

ASMedia® USB 3.2 Gen 2 controller :,8 x USB 3.1 Gen 1 連接埠 (6 位於背板, , 2 位於主機板中),4 x USB 2.0 連接埠 (4 位於背板, ),1 x USB 3.1 Gen 2 連接埠 (1 位於主機板中),Intel® X299 Chipset :,2 x USB 3.1 Gen 2 連接埠 (2 位於背板, , Type-A + USB Type-C^TM)

- Industry leading Digital 8 Phase CPU Power Design,- Industry leading Digital 2 Phase DRAM Power Design,- Ai Charger+,- Crystal Sound 3,- ASUS USB BIOS Flashback^™,M.2 and U.2 Onboard (The Latest Transfer Technology with up to 32Gb/s Data-transfer Speeds for M.2 and U.2),Asus Control Center (ACC) IT management software supported,華碩數位電源設計:,- 多國語言 BIOS,- 5-Way Optimization tuning key perfectly consolidates TPU, EPU, DIGI+ VRM, Fan Xpert 4, and Turbo Core App,OC Design - ASUS PRO Clock II Technology,- ASUS Q-Shield,- Aura Addressable Strip Header(s),- 華碩 CrashFree BIOS,- 華碩 EZ Flash,Fan Xpert4,- Fan Xpert 4 featuring Fan Auto Tuning function and multiple thermistors selection for optimized system cooling control,ASUS 5X Protection III :
- ASUS SafeSlot Core: Fortified PCIe Slot prevents damage,- ASUS Enhanced DRAM Overcurrent Protection - Short circuit damage prevention,- ASUS ESD Guards - Enhanced ESD protection,- EPU,5-Way Optimization by Dual Intelligent Processors 5,TPU,- ASUS Overvoltage Protection: World-class circuit-protecting power design,- ASUS Stainless-Steel Back I/O: 3X corrosion-resistance for greater durability!,- AI Suite 3,AURA :,- Aura RGB Strip Headers,華碩 EPU :,華碩獨家功能 :,華碩 EZ DIY :,華碩 Q-Design :,- 華碩 Q-Code,- 華碩 Q-LED (CPU, DRAM, VGA, Boot Device LED),- 華碩 Q-Slot,- 華碩 Q-DIMM,- 華碩 Q-Connector

Windows® 10 64-bit

1 x USB 3.2 Gen 2 (teal blue)Type-A,,1 x USB 3.2 Gen 2 (黑色)USB Type-C^™,6 x USB 3.2 Gen 1 (藍色),4 x USB 2.0 (one port can be switched to USB BIOS Flashback^™),2 x LAN (RJ45) 連接埠,1 x 8-channel Audio I/O,1 x USB BIOS Flashback^™ Button(s),1 x 光纖 S/PDIF 輸出

1 x USB 3.2 Gen 2 front panel connector,2 x U.2 port,1 x 6-pin ATX Power connector,1 x EZ XMP switch,1 x MemOK! Button,2 x 8-pin ATX 12V 電源接頭,1 x CPU_OV jumper,1 x Thunderbolt header(s),1 x Clear CMOS button(s),1 x Aura Addressable Strip Header(s),1 x M.2 Socket 3 with M key, type 2242/2260/2280/22110 storage devices support (PCIE 3.0 x 4 mode),1 x VROC_HW_Key,1 x Aura RGB Strip Header,1 x M.2 Socket 3 with M key, type 2242/2260/2280 storage devices support (PCIE 3.0 x 4 mode),1 x TPM header,1 x 5-pin EXT_FAN(Extension Fan) connector,1 x Water Pump header (4-pin),1 x COM 接頭連接埠,1 x USB 3.0 接頭支援額外的 2 USB 3.0 連接埠,1 x AAFP connector,1 x CPU OPT Fan connector(s),1 x AIO_PUMP connector,1 x System panel connector,1 x Thermal sensor connector,1 x M.2 Fan Header,8 x SATA 6Gb/s 接頭,1 x CPU 風扇接頭,2 x 機殼風扇接頭,1 x 24-pin EATX 電源接頭,1 x Power-on 按鈕,1 x Reset 按鈕

Addressable LED extension cable,1 x COM port cable(s),1 x M.2 screws,1 x MOS Cooling kit (fan bracket and 40mm x 40mm fan),1 x 4-Way SLI bridge(s),8 x Serial ATA 6.0Gb/s 纜線,1 x 3-Way SLI 橋接卡,1 x Vertical M.2 bracket set,1 x SLI HB BRIDGE(2-WAY-M),1 x Supporting DVD,1 x Q-Connector,I/O 擋板,使用者手冊

12 吋 x 10.5 吋 ( 30.5 公分 x 26.7 公分 ),CEB 主機板尺寸

Color Box(3-in-1)
Net Weight: 5.55kg
Gross Weight: 8.06kg

Bulk Pack(5-in-1)
Net Weight: 6.99kg
Gross Weight: 9.37kg

Operation temperature: 10℃ ~ 35℃
Non operation temperature: -40℃ ~ 70℃
Non operation humidity: 20% ~ 90% ( Non condensing)

*Intel® VROC is supported via RSTe, and Intel® VROC_HW_key. VROC_HW_Key is purchased separately. NVMe RAID type and function will depend on the Intel® VROC_HW_key installed.

*1 The U.2 connectors are only supported on 44-Lane CPUs.
*2 Please refer to the block diagrams in the Appendix for more details in the manual.